Improvement of Corrosion Resistance of Transistor Leads by Compositive Gold Plating

Li Jiuqing; Lu Cuiying; Shen Zhuoshen; Hu Maopu; Wang Baojue; Pu Yumei

doi:10.13374/j.issn1001-053x.1988.02.034

Volume 10 Issue 2

Nov. 2021

Turn off MathJax

Article Contents

Article Navigation > Chinese Journal of Engineering > 1988 > 10(2): 234-240

Li Jiuqing, Lu Cuiying, Shen Zhuoshen, Hu Maopu, Wang Baojue, Pu Yumei. Improvement of Corrosion Resistance of Transistor Leads by Compositive Gold Plating[J]. Chinese Journal of Engineering, 1988, 10(2): 234-240. doi: 10.13374/j.issn1001-053x.1988.02.034

Citation:

Li Jiuqing, Lu Cuiying, Shen Zhuoshen, Hu Maopu, Wang Baojue, Pu Yumei. Improvement of Corrosion Resistance of Transistor Leads by Compositive Gold Plating[J]. Chinese Journal of Engineering, 1988, 10(2): 234-240. doi: 10.13374/j.issn1001-053x.1988.02.034

Citation:

PDF( 631 KB)

Improvement of Corrosion Resistance of Transistor Leads by Compositive Gold Plating

doi: 10.13374/j.issn1001-053x.1988.02.034

Received Date: 1986-11-21
Available Online: 2021-11-15

Abstract

Abstract

This paper reports the new technology which improves the corrosion resistance of transtor leads by compositive gold plating. A plating system consisting of dark nickel, Ni-Al₂O₃ compositive plating and acidic pulse gold plating is plated on Kovar leads. The porous gold plating system decreases the tendency of corrosion fracture distinctly.
- kovar,
- transistor,
- stress corrosion crack,
- porous gold plating