Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials

Zhou Wenyu; Xia Shouyu; Chen Jiajun

doi:10.13374/j.issn1001-053x.1988.03.006

Volume 10 Issue 3

Nov. 2021

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Zhou Wenyu, Xia Shouyu, Chen Jiajun. Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials[J]. Chinese Journal of Engineering, 1988, 10(3): 313-316. doi: 10.13374/j.issn1001-053x.1988.03.006

Citation:

Zhou Wenyu, Xia Shouyu, Chen Jiajun. Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials[J]. Chinese Journal of Engineering, 1988, 10(3): 313-316. doi: 10.13374/j.issn1001-053x.1988.03.006

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Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials

doi: 10.13374/j.issn1001-053x.1988.03.006

Received Date: 1987-07-21
Available Online: 2021-11-15

Abstract

Abstract

After the Ag-Cu and Ag-H62 electric contact materials arc made by cold press-rolling (or sputtering in magnetic field) and annealed, the quantitative and semi-quantitative analysis are carred out by scanning electron microscope. The results show that the interfaces are of metallic bonding. The diffusion coefficients and the activation energies are also calculated.
- activation energy,
- cold press,
- diffusion coefficient,
- sputtering,
- cold press rolling,
- sputtering in magnetic field