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    Meng Huimin, Wu Jixun, Liu Qunxian, Lu Yanping, Zhang Puqiang. High Speed Zn-Ni Alloy Electroplating[J]. Chinese Journal of Engineering, 1996, 18(5): 473-476,481. doi: 10.13374/j.issn1001-053x.1996.05.017
    Citation: Meng Huimin, Wu Jixun, Liu Qunxian, Lu Yanping, Zhang Puqiang. High Speed Zn-Ni Alloy Electroplating[J]. Chinese Journal of Engineering, 1996, 18(5): 473-476,481. doi: 10.13374/j.issn1001-053x.1996.05.017

    High Speed Zn-Ni Alloy Electroplating

    doi: 10.13374/j.issn1001-053x.1996.05.017
    • Received Date: 1994-04-28
      Available Online: 2021-11-13
    • The electrolyte was compelled to form turbulent flow by using speed electroplating apparatus. The Zn-Ni alloy electro-deposition law in simple sulphate system under high current density was studied. The results indicated that Zn-Ni alloy electroplating is abnormal co-deposition. The content of nickel in the deposite increases with the increase of the ratio of Ni/Ni+Zn and the current density. It decreases with the increase of the fluid speed of electrolyte. On the above basis, the technology of high speed Zn-Ni alloy electroplating has been determined.

       

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