• Volume 21 Issue 5
    Aug.  2021
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    Han Jingtao, Wu Zhiping, Meng Fucai, Liu Qianli. Analyses on the Performance of Temperature in the Linking Region of CSP Technology[J]. Chinese Journal of Engineering, 1999, 21(5): 451-454. doi: 10.13374/j.issn1001-053x.1999.05.037
    Citation: Han Jingtao, Wu Zhiping, Meng Fucai, Liu Qianli. Analyses on the Performance of Temperature in the Linking Region of CSP Technology[J]. Chinese Journal of Engineering, 1999, 21(5): 451-454. doi: 10.13374/j.issn1001-053x.1999.05.037

    Analyses on the Performance of Temperature in the Linking Region of CSP Technology

    doi: 10.13374/j.issn1001-053x.1999.05.037
    • Received Date: 1999-02-01
      Available Online: 2021-08-27
    • The performance of temperature is analyzed in the linking region of CSP technology. Firstly, analyses are done on the temperature of the slabs before being charged. pointing out the influence factors, the changing status and the cooling features of the temperature of the slabs in this region. Secondly, researches of the heating of the slabs are done especially on the heating behavior, the heating characteristics, the selecting of models and the requirement on temperature reservation in the heating stage. Finally, the cooling pattern of the slabs in the linking region of CSP is put forward, and the corresponding model presented.

       

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