Thermal Stress Analysis of Large Area Diamond Films

HUANG Tianbin; LIU Jingming; TANG Weizhong; TONG Yumei; YU Wenxiu; LU Fanxiu

doi:10.13374/j.issn1001-053x.2000.02.016

Volume 22 Issue 2

Aug. 2021

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Article Navigation > Chinese Journal of Engineering > 2000 > 22(2): 153-155

HUANG Tianbin, LIU Jingming, TANG Weizhong, TONG Yumei, YU Wenxiu, LU Fanxiu. Thermal Stress Analysis of Large Area Diamond Films[J]. Chinese Journal of Engineering, 2000, 22(2): 153-155. doi: 10.13374/j.issn1001-053x.2000.02.016

Citation:

HUANG Tianbin, LIU Jingming, TANG Weizhong, TONG Yumei, YU Wenxiu, LU Fanxiu. Thermal Stress Analysis of Large Area Diamond Films[J]. Chinese Journal of Engineering, 2000, 22(2): 153-155. doi: 10.13374/j.issn1001-053x.2000.02.016

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Thermal Stress Analysis of Large Area Diamond Films

doi: 10.13374/j.issn1001-053x.2000.02.016

Materials Science and Engineering School, UST Beijing, Beijing 100083, China

Received Date: 1999-01-12
Available Online: 2021-08-27

Abstract

Abstract

The distribution of the thermal stress of large area diamond films is given by applying the actual boundary condition, and it is checked by experiments. The result is that the thermal stress of large area diamond films is not uniform, the thermal stress in the middle of large area diamond films is lager than that in the edge of large area diamond films, the press stress is the mainly part of the thermal stress. The crack of diamond films is mainly duo to the large press stress.
- large area diamond films,
- the thermal stress,
- numerical calculation