Abstract: The texture of interconnecting aluminum films prepared by conventional and modified technology was examined using X-ray diffraction It is demonstrated, that the high volume fraction and high sharpness of the { 111 } fiber texture will drastically reduce the invalidation ratio of very large-scale integrated electronic circuits. The reasons of invalidation and the positive effects of the {111 } fiber texture are discussed. It is pointed out, that attention should be paid to the corresponding texture problems in new interconnecting copper films.