金剛石/硅復合材料的制備和導熱性能

謝文靜; 劉全有; 沈卓身; 戴品

doi:10.13374/j.issn1001-053x.2010.11.017

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金剛石/硅復合材料的制備和導熱性能

doi: 10.13374/j.issn1001-053x.2010.11.017

1. 北京科技大學材料科學與工程學院, 北京 100083;
2. 北京興隆莊金剛石廠, 北京 101206

詳細信息

作者簡介:
謝文靜(1987-),女,碩士研究生;沈卓身(1945-),男,教授,博士生導師,E-mail:shenzs@mater.ustb.edu.cn

中圖分類號: TB332
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- 文章訪問數: 174
- HTML全文瀏覽量: 36
- PDF下載量: 5
- 被引次數: 0
出版歷程
- 收稿日期: 2010-01-19

Preparation and thermal conductivity of diamond/Si composites

1. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China;
2. Beijing Xing-Long Village Diamond Factory, Beijing 101206, China

摘要

摘要: 為探索新型熱沉用散熱材料,采用高溫高壓方法燒結制備了金剛石/硅復合材料,并研究了金剛石大小粒度混粉、金剛石含量、滲硅工藝以及金剛石表面鍍鈦對復合材料的致密度和導熱性能的影響.結果表明:在大粒度金剛石粉中摻入小粒度金剛石粉、滲硅和金剛石表面鍍鈦處理都可提高金剛石/硅復合材料的致密度和熱導率;隨著金剛石含量增大,復合材料熱導率提高;其中75/63μm鍍鈦金剛石顆粒與40/7μm金剛石顆粒的混粉,當混粉質量分數為95%時,在4～5GPa、1400℃高溫高壓滲硅燒結,金剛石/硅復合材料的熱導率可高達468.3W·m^-1·K^-1.
- 復合材料 /
- 熱導率 /
- 致密度 /
- 滲硅 /
- 金剛石顆粒
Abstract: In order to develop a new heat-spreading material used as heat sink,diamond/Si composites were synthesized by a high-pressure high-temperature(HPHT) method.An investigation was conducted on the effects of diamond particle size,diamond content,siliconizing process,and coating Ti on diamond particles on the density and thermal conductivity of the composites.The results show that mixing large and small size diamond particles,coating Ti and siliconizing process are effective to improve the density and thermal conductivity of diamond/Si composites.The thermal conductivity rises with the content of diamond increasing.When the mass fraction of diamond blended by 75/63μm Ti-coated diamond particles and 40/7μm diamond particles is 95%,the thermal conductivity of the composite sintered at 4~5GPa and 1400℃ by the HPHT siliconizing method can reach to 468.3W·m^-1·K^-1.
- composite materials /
- thermal conductivity /
- density /
- siliconization /
- diamond particles