Electrodeposition of Cu-Ni Layered Films by Dual Potential Pulse Method

Xue Jiangyun; Wu Jixun; Yang Dejun

doi:10.13374/j.issn1001-053x.1996.05.019

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Xue Jiangyun, Wu Jixun, Yang Dejun. Electrodeposition of Cu-Ni Layered Films by Dual Potential Pulse Method[J]. Chinese Journal of Engineering, 1996, 18(5): 482-485. doi: 10.13374/j.issn1001-053x.1996.05.019

Citation:

Xue Jiangyun, Wu Jixun, Yang Dejun. Electrodeposition of Cu-Ni Layered Films by Dual Potential Pulse Method[J]. Chinese Journal of Engineering, 1996, 18(5): 482-485. doi: 10.13374/j.issn1001-053x.1996.05.019

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Electrodeposition of Cu-Ni Layered Films by Dual Potential Pulse Method

doi: 10.13374/j.issn1001-053x.1996.05.019

Depatment of Surface Science and Corrosion Engineering, USTB, Beijing 100083, PRC

Received Date: 1995-10-18
Available Online: 2021-11-13

Abstract

Abstract

A method has been developed to produce Cu-Ni composition-modulated alloys from a simple electrolyte by electrodeposition.The effects of the concentration of copper ions,additives and the speed of rotation were investigated.The results were analysed by SEM and X-ray diffraction.The result indicated that the film was alternating pure copper and copper-nickel alloy layers.If the content of copper in nickel layer is to be small, the concentration of its ions in solution must be small and the rotation speed must be low.
- electro-deposition,
- copper-nickel alloy,
- layer structure material