Dependence of Structure Stability of Electrodepositing Amorphous Cr-C and Ni-P on C,P Contents

Yu Weiping; Duan Shuzhen

doi:10.13374/j.issn1001-053x.1996.s2.014

Volume 18 Issue S2

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Yu Weiping, Duan Shuzhen. Dependence of Structure Stability of Electrodepositing Amorphous Cr-C and Ni-P on C,P Contents[J]. Chinese Journal of Engineering, 1996, 18(S2): 64-68. doi: 10.13374/j.issn1001-053x.1996.s2.014

Citation:

Yu Weiping, Duan Shuzhen. Dependence of Structure Stability of Electrodepositing Amorphous Cr-C and Ni-P on C,P Contents[J]. Chinese Journal of Engineering, 1996, 18(S2): 64-68. doi: 10.13374/j.issn1001-053x.1996.s2.014

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Dependence of Structure Stability of Electrodepositing Amorphous Cr-C and Ni-P on C,P Contents

doi: 10.13374/j.issn1001-053x.1996.s2.014

Yu Weiping¹,
Duan Shuzhen²

1. Beijing University of Aeronautics and Astronautics, Beijing 100083, PRC;
2. University of Science and Technology Beijing

Received Date: 1996-01-22
Available Online: 2021-11-13

Abstract

Abstract

The dependence of structure stability of electrodepositing amorphous Cr-C and Ni-P films on their components have been researched by action of high accelerated voltage electronic cluster. It was shown that, when temperature was far lower than crystalline temperature, the lower the content of submetallic element in films,the bigger the extent to crystallize.
- Cr-C,
- Ni-P,
- amorphous film,
- structure stability