Preparation of SiCp/Al Electronic Packaging Composite Preforms

SiCp and binder were mixed together and SiCp preforms were prepared by warm pressing, thermal debinding and pre-sintering. The relations of the performances such as size variation, porosity and strength of the performs with process parameters were investigated. The microstructure of the performs was observed by SEM. The results show that SiCp preforms with suitable strength and porosity for preparing SiCp/Al composites can be obtained by controlling effectively the process parameters such as compaction, debinding and pre-sintering.