• Volume 31 Issue 12
    Aug.  2021
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    ZHANG Fu-yi, LIU Hui-min, LIU Li. Reheated microstructures of semi-solid ingots of TiCp/7075Al composites[J]. Chinese Journal of Engineering, 2009, 31(12): 1583-1587. doi: 10.13374/j.issn1001-053x.2009.12.010
    Citation: ZHANG Fu-yi, LIU Hui-min, LIU Li. Reheated microstructures of semi-solid ingots of TiCp/7075Al composites[J]. Chinese Journal of Engineering, 2009, 31(12): 1583-1587. doi: 10.13374/j.issn1001-053x.2009.12.010

    Reheated microstructures of semi-solid ingots of TiCp/7075Al composites

    doi: 10.13374/j.issn1001-053x.2009.12.010
    • Received Date: 2009-03-16
      Available Online: 2021-08-09
    • The reheated microstructures and influencing factors of semi-solid ingots of 4.4% TiCp/7075 composites were investigated by SEM, TEM and DSC. The results show that the optimal remehed parameters of 4.4% TiCp/7075 composites are the remolded temperature of 590 to 610℃ and the holding time of 10 to 20 min. 4.4% TiCp/7075 composites are of high stability during the remelting process and the size of spherical grains can hardly increase with the increase of temperature and holding time. The coarsening velocity of grains in 4.4% TiCp/7075 is 118.96μm3·s-1, which is less than 311.7 μm3· s-1 for 7075 matrix alloy, and more suitable for semi-solid thixoforming.

       

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